
The working principle of Peltier Effect-Based Wearable Cooling
- The core principle of semiconductor refrigeration chips: Peltier Effect
Semiconductor cooling sheets (also known as TEC sheets, full name Thermoelectric Cooler) are based on the Peltier effect, which is a phenomenon that occurs when an electric current is passed through the interface of different types of conductors or semiconductor materials.
When the current passes through the cooler:
Endothermic cooling
Heat transfer on the other side
By effectively managing the heat on both sides of the refrigeration sheet, the “cold end” can produce a significant cooling effect in a very short time.
How TEC chips are integrated in wearable devices
Structure levels generally include:
Skin layer (clothing fabric) : soft, breathable, skin-friendly and wear-resistant
TEC chip module layer: lightweight P/N type thermoelectric pair array package
Heat dissipation module (active fan or graphite heat conductive sheet) : helps the hot end to dissipate heat quickly and keep the cold end working continuously
Intelligent electronic control module: responsible for current control, temperature regulation, safety monitoring, etc
Power supply system: 5V/12V mobile power supply is common
Technical advantages and breakthrough points
Cooling without moving parts (compared to conventional compressor refrigeration)
No chemical refrigerant, no noise, no vibration
Small size, wearable, low energy consumption
Fast response: rapid cooling in 3-5 seconds after power-on
The latest generation of semiconductor refrigeration tablets have achieved lamination + flexible packaging, suitable for clothing, vests, insoles and other wearable structures, with intelligent temperature control technology to achieve accurate, adjustable personal cooling system.
Application Scenarios
High temperature working environment (construction, storage, transportation)
Daily outdoor activities (cycling, fishing, camping)
Medically assisted cooling (e.g. fever, rehabilitation)
High intensity heat load protection in military police/sports field
Future development direction: Integrated flexible battery + wearable intelligent control system
Current challenges and development direction
Heat dissipation efficiency bottleneck: Efficient removal of heat from the hot end is required to maintain cold end performance
Flexible compatibility: Flexible thermoelectric materials are being developed to adapt to the dynamic wearing of close-fitting clothing
Power consumption optimization: Reduce battery load for longer battery life
Overall weight balanced with comfort
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